In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering

Oliver Scholz; Michael Eisenbarth; Randolf Hanke; Thomas Bigl; Peter Schmitt

doi:10.1117/12.484664

22 July 2003 In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering

Oliver Scholz, Michael Eisenbarth, Randolf Hanke, Thomas Bigl, Peter Schmitt

Proceedings Volume 5045, Testing, Reliability, and Application of Micro- and Nano-Material Systems; (2003) https://doi.org/10.1117/12.484664
Event: NDE for Health Monitoring and Diagnostics, 2003, San Diego, California, United States

Abstract

While solder joints of integrated circuits in BGA and uBGA packages can be tested with 3D-computed tomography, this process is time consuming and too expensive for anything but samples or small production volumes. This paper explores approaches to facilitate a 2D-imaging testing system for BGA and uBGA solder joints. Non-standard pad geometries can be used to cause a deformation of the solder balls during soldering; this deformation is detectable in a 2D-image. By integrating a compact X-Ray-source/detector unit into a reflow soldering station, controlling the quality of the solder joints in real-time during soldering will become possible. This information can then be fed back into the soldering station in order to optimize the soldering process.

Citation Download Citation

Oliver Scholz, Michael Eisenbarth, Randolf Hanke, Thomas Bigl, and Peter Schmitt "In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering", Proc. SPIE 5045, Testing, Reliability, and Application of Micro- and Nano-Material Systems, (22 July 2003); https://doi.org/10.1117/12.484664

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