Optical profilometer featuring multiple virtual styli for the packaging and interconnect environment

Royce Clark; Robert H. Flake; Asif Siddique

doi:10.1117/12.186651

14 September 1994 Optical profilometer featuring multiple virtual styli for the packaging and interconnect environment

Royce Clark, Robert H. Flake, Asif Siddique

Proceedings Volume 2337, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing; (1994) https://doi.org/10.1117/12.186651
Event: Microelectronic Manufacturing, 1994, Austin, TX, United States

Abstract

A prototype optical profilometer providing automated surface profile measurements utilizing multiple virtual styli with micron height resolution has been developed. Measurement applications illustrated in this paper include TAB Inner Lead Bond (ILB) height and planarity, surface curvature of die mounted in ceramic packages, and MCM flipchip substrate post flatness.

Citation Download Citation

Royce Clark, Robert H. Flake, and Asif Siddique "Optical profilometer featuring multiple virtual styli for the packaging and interconnect environment", Proc. SPIE 2337, Optical Characterization Techniques for High-Performance Microelectronic Device Manufacturing, (14 September 1994); https://doi.org/10.1117/12.186651

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