Residual stress measurements with laser speckle correlation interferometry and local heat treating

Martin J. Pechersky; Robert F. Miller; Chandra S. Vikram

doi:10.1117/12.206230

12 April 1995 Residual stress measurements with laser speckle correlation interferometry and local heat treating

Martin J. Pechersky, Robert F. Miller, Chandra S. Vikram

Proceedings Volume 2406, Practical Holography IX; (1995) https://doi.org/10.1117/12.206230
Event: IS&T/SPIE's Symposium on Electronic Imaging: Science and Technology, 1995, San Jose, CA, United States

Abstract

A new experimental technique has been devised to measure residual stresses in ductile materials with a combination of laser speckle pattern interferometry and spot heating. The speckle pattern interferometer measures in-plane deformations while the heating provides for very localized stress relief. The residual stresses are determined by the amount of strain that is measured subsequent to the heating and cool-down of the region being interrogated. A simple lumped parameter model is presented to provide a description of the method. This description is followed by presentation of the results of finite element analyses and experimental results with uniaxial test specimens. Excellent agreement between the experiments and the computer analyses were obtained.

Citation Download Citation

Martin J. Pechersky, Robert F. Miller, and Chandra S. Vikram "Residual stress measurements with laser speckle correlation interferometry and local heat treating", Proc. SPIE 2406, Practical Holography IX, (12 April 1995); https://doi.org/10.1117/12.206230

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