Printability of laser mask repairs at deep UV

James A. Reynolds; Franklin M. Schellenberg

doi:10.1117/12.212794

3 July 1995 Printability of laser mask repairs at deep UV

James A. Reynolds, Franklin M. Schellenberg

Proceedings Volume 2512, Photomask and X-Ray Mask Technology II; (1995) https://doi.org/10.1117/12.212794
Event: Photomask Japan 1995, 1995, Kanagawa, Japan

Abstract

Over 50% of today's 5X reticles require some sort of repair to meet the zero defect criteria. A successful repair must remove materials so the aerial image of the defective site is identical to that of a nondefective site within the tolerance required by the printing process. Shorter printing wavelengths increase sensitivity to surface roughness and deposited film. In this study, two different laser repair techniques were used to remove selected defects from a standard KLA defect printability reticle and the reticle was printed onto wafers at 248 nm. An atomic force microscope (AFM), aerial image measurement system (AIMS) and scanning electron microscope (SEM) were used to evaluate the reticle and wafer sites.

Citation Download Citation

James A. Reynolds and Franklin M. Schellenberg "Printability of laser mask repairs at deep UV", Proc. SPIE 2512, Photomask and X-Ray Mask Technology II, (3 July 1995); https://doi.org/10.1117/12.212794

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