Flip-chip optical fiber attachment to a monolithic optical receiver chip

Vijayanand Vusirikala; Peter J.S. Heim; Mario Dagenais; C. Philip McClay

doi:10.1117/12.228877

27 December 1995 Flip-chip optical fiber attachment to a monolithic optical receiver chip

Vijayanand Vusirikala, Peter J.S. Heim, Mario Dagenais, C. Philip McClay

Proceedings Volume 2613, Emerging Components and Technologies for All-Optical Networks; (1995) https://doi.org/10.1117/12.228877
Event: Photonics East '95, 1995, Philadelphia, PA, United States

Abstract

We report on manufacturable, low cost scheme for precision packaging a monolithically integrated GaAs optical receiver. Silicon V-groove and flip-chip bonding technologies are used to reliably achieve the required alignment accuracy. A silicon fiber carrier, which houses the fiber in a V-groove, is flip-chip bonded on to the receiver chip. The light from the cleaved end of the fiber is reflected off the V-groove end on to the planar photodetector, with an optical coupling efficiency of 85%. The entire fiber attach process uses standard semiconductor fabrication and processing techniques, making it attractive for low cost manufacturing.

Citation Download Citation

Vijayanand Vusirikala, Peter J.S. Heim, Mario Dagenais, and C. Philip McClay "Flip-chip optical fiber attachment to a monolithic optical receiver chip", Proc. SPIE 2613, Emerging Components and Technologies for All-Optical Networks, (27 December 1995); https://doi.org/10.1117/12.228877

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