Inspecting the new generation of reticles using UV imaging

Mark Andrew Merrill; James N. Wiley; Benjamin George Eynon Jr.

doi:10.1117/12.346228

23 April 1999 Inspecting the new generation of reticles using UV imaging

Mark Andrew Merrill, James N. Wiley, Benjamin George Eynon Jr.

Proceedings Volume 3665, 15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98; (1999) https://doi.org/10.1117/12.346228
Event: 15th European Conference on Mask Technology for Integrated Circuits and Micro-Components, 1998, Munich, Germany

Abstract

The manufacturing of advanced reticles for deep UV steppers has stressed the mask industry's writing, processing, inspection and repair capabilities. Meeting technology demands has been especially arduous for reticle defect inspection with the rapid evolution of both novel PSM materials and OPC geometries. Also, the switch to a 4x- reduction ratio and every-lower k₁ wafer lithography has resulted in increased overall defect printability. To respond to these challenges, a new reticle inspection system with laser UV imaging has been evaluated and shown to achieve mask defect sensitivity of 150 nm and below on DUV EA-PSM and OPC masks.

Citation Download Citation

Mark Andrew Merrill, James N. Wiley, and Benjamin George Eynon Jr. "Inspecting the new generation of reticles using UV imaging", Proc. SPIE 3665, 15th European Conference on Mask Technology for Integrated Circuits and Microcomponents '98, (23 April 1999); https://doi.org/10.1117/12.346228

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