Paper
1 July 2002 Cost of ownership analysis for patterning using step and flash imprint lithography
Author Affiliations +
Abstract
While the critical dimension in the microelectronics industry is continually going down due to developments in photolithography, it is coming at the expense of exponential increase in lithography tool costs and rising photomask costs. Step and Flash Imprint Lithography (S-FIL) is a nano-patterning technique that results in significantly lower cost of the lithography tool and process consumables. In this study, a comparison of S-FIL with Extreme Ultraviolet (EUV) photolithography technique is provided at the 50nm node. Advantages and disadvantages of S-FIL for various application sectors are provided. Finally, cost of ownership (CoO) computations of S-FIL versus EUV is provided. CoO computations indicate that S-FIL may be the cost-effective technology in the sub-100nm domain, particularly for emerging devices that are required in low volumes.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. V. Sreenivasan, C. Grant Willson, Norman E. Schumaker, and Douglas J. Resnick "Cost of ownership analysis for patterning using step and flash imprint lithography", Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); https://doi.org/10.1117/12.472275
Lens.org Logo
CITATIONS
Cited by 19 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Lithography

Extreme ultraviolet

Optical lithography

Photomasks

Inspection

Semiconducting wafers

Extreme ultraviolet lithography

RELATED CONTENT


Back to Top