Paper
7 June 2002 Micromaterials Center Berlin: reliability research for MEMS
Bernd Michel, Thomas Winkler
Author Affiliations +
Abstract
The Micro Materials Center Berlin (MMCB) located at the Fraunhofer Institute IZM belongs to three German Centers for Materials Research in Microtechnology funded by the German Ministry for Education and Research (BMBF). The paper presents some recent results obtained in the field of electronic packaging for MEMS. A survey is given concerning advanced interconnection technologies (chip size packaging, BGA, wafer level packaging etc.) taking into account new developments in the field of materials research for packaging in various applications, e.g. in automotive and telecommunication systems. Special attention will be given to overcome the reliability gap which can be found in the field of microsystem reliability (e.g. high temperature electronics, lead-free solder applications in MEMS etc.). The authors present recent results obtained in the different branch labs of MMCB situated in Berlin, Munich, Chemnitz, Oberpfaffenhofen, and Teltow. New fields of applications are dealt with e.g. polytronics, micromechatronics.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bernd Michel and Thomas Winkler "Micromaterials Center Berlin: reliability research for MEMS", Proc. SPIE 4703, Nondestructive Evaluation and Reliability of Micro- and Nanomaterial Systems, (7 June 2002); https://doi.org/10.1117/12.469614
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KEYWORDS
Reliability

Packaging

Microelectromechanical systems

Finite element methods

Microsystems

Composites

Manufacturing

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