Prof. Bernd Michel Profile

Prof. Bernd Michel

Departmental Head at Fraunhofer-Institut für Elektronische Nanosysteme

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Author

Publications (32)

Proceedings Article | 30 April 2007 Paper

NanoDAC: object deformation measurements for micro and nanotechnology applications

Jürgen Keller, Dietmar Vogel, Bernd Michel

Proceedings Volume 6528, 65280B (2007) https://doi.org/10.1117/12.717639

KEYWORDS: Atomic force microscopy, Scanning electron microscopy, Scanning probe microscopy, Digital image correlation, Photomicroscopy, Mechanics, Microelectromechanical systems, Ion beams, Nanotechnology, Reliability

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The manufacturing, handling and control of micro and nano scale devices require the quantification of their geometrical and mechanical properties. While the measurement of geometrical and size data is easily accessible by SFM and SEM imaging equipment, mechanical characterization is a general problem for these objects. Different kinds of size effects more often force material property determination directly on micro/nano objects. Therefore, new strategies for material testing have to be developed. Displacements and their derivatives are two basic properties to be measured during testing for many mechanical material properties. The authors make use of SFM and high resolution SEM imaging in order to obtain spatially resolved displacement data over the scan area. Locally applied cross correlation algorithms are utilized to compute displacement fields and the corresponding first order derivatives. Micrographs are captured subsequently for different object load states. The established technique and measurement system (nanoDAC) is reviewed briefly. The authors present different applications of the nanoDAC method establishing the characterization of micro/nano scale material behaviour. Among the application fields are approaches to measure fracture mechanics criteria from crack opening displacement (COD) fields, a method of measuring residual stresses in thin membranes and testing techniques to measure Young's modulus and Poisson's ratios of thin foils and micro wires. The measurement of fracture mechanics bases on linear elastic fracture mechanics. Measured by AFM, COD fields in the very vicinity of crack tips are used to extract fracture toughness values. Stress determination on membranes utilizes the unique capability of focused ion beam (FIB) equipment, which allows concurrent material milling and micrograph capture with high resolution. A Zeiss XBeam system has been used to mill trenches and holes into membranes of semiconductor structures. Treated that way stress release fields are determined from SEM micrographs. Taking into consideration reasonable stress hypotheses, membrane stresses are calculated from the obtained deformation fields. With the presented methods the basis is provided for an experimental reliability analysis of MEMS/NEMS and nanodevices.

Proceedings Article | 11 April 2007 Paper

Measurement of stresses in MEMS structures by stress release

Dietmar Vogel, Neus Sabate, Astrid Gollhardt, Bernd Michel

Proceedings Volume 6528, 65280Y (2007) https://doi.org/10.1117/12.716291

KEYWORDS: Silicon, Ions, Thin films, Microelectromechanical systems, Digital image correlation, Chemical elements, Manufacturing, Packaging, Low pressure chemical vapor deposition, Silicon films

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Proceedings Article | 28 April 2006 Paper

High-resolution stress measurements for microsystem and semiconductor applications

Dietmar Vogel, Juergen Keller, Bernd Michel

Proceedings Volume 6188, 61880P (2006) https://doi.org/10.1117/12.669637

KEYWORDS: Digital image correlation, Silicon, Microsystems, Ion beams, Ions, Microelectromechanical systems, Photomicroscopy, Semiconductors, Sensors, Micromachining

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Proceedings Article | 4 April 2006 Paper

Nanoscale deformation measurements for reliability assessment of material interfaces

Jürgen Keller, Astrid Gollhardt, Dietmar Vogel, Bernd Michel

Proceedings Volume 6175, 617504 (2006) https://doi.org/10.1117/12.658637

KEYWORDS: Reliability, Interfaces, Digital image correlation, Scanning probe microscopy, Atomic force microscopy, Finite element methods, Microelectronics, Chemical elements, Microelectromechanical systems, Polymers

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Proceedings Article | 4 April 2006 Paper

FIB-based measurement of local residual stresses on microsystems

Dietmar Vogel, Neus Sabate, Astrid Gollhardt, Juergen Keller, Juergen Auersperg, Bernd Michel

Proceedings Volume 6175, 617505 (2006) https://doi.org/10.1117/12.658298

KEYWORDS: Digital image correlation, Silicon, Microsystems, Ion beams, Ions, Microelectromechanical systems, Photomicroscopy, Micromachining, Sensors, Manufacturing

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Proceedings Article | 16 March 2006 Paper

Nanoscale deformation measurements to improve reliability assessment of sensors and MEMS

Bernd Michel, Jürgen Keller, Hans Walter

Proceedings Volume 6179, 61790J (2006) https://doi.org/10.1117/12.660144

KEYWORDS: Sensors, Atomic force microscopy, Gas sensors, Digital image correlation, Microelectromechanical systems, Reliability, Scanning electron microscopy, Scanning probe microscopy, Ions, Ion beams

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Micro machined micro sensors for gas or flow detection based on physical behaviour of a special layer of a membrane have to fulfil high quality and reliability requirements especially in safety or security applications. Up to now, most of the research studies neglected mechanical issues related to reliability of these structures. In this sense, the study and characterization of the stress distribution on the membranes after fabrication and during their operative life is required. Thin films used in micromachined structures exhibit residual mechanical stress strongly dependent on the layer composition and the deposition process parameters. Often, a deposition of a multilayer is required, and this adds factors like abrupt transitions in thermal, elastic and plastic mismatch across the interfaces that have a direct effect on the resultant stress. Moreover, in operating conditions, a thermal stress originated due to the difference in the thermal expansion coefficient (CTE) of the membrane materials adds to the residual stress of the membrane. The resultant stresses can induce excessive deformation, fracture, delamination and microstructural changes in the material that can lead to the breaking of the structure during the fabrication stage or affect the behaviour of the final device. In the present work, the 2D deformation of a gas and a flow sensor membrane under different thermo-mechanical load states will be analysed by means of the digital image correlation (DIC) techniques based on scanning probe microscopy (SPM) data. With this technique which is introduced as the nanoDAC method (nano Deformation Analysis by Correlation) deformation fields can be determined with nanometer-accuracy. In addition ion milling by focused ion beam (FIB) technique is demonstrated at membrane specimens with residual stresses. Object deformations fields nearby the milling area are measured by fibDAC allowing the evaluation of very local residual stresses. Some principal experiments illustrate the feasibility of the chosen approach.

Proceedings Article | 1 July 2005 Paper

3D deformation analysis of flow and gas sensors membranes for reliability assessment

Neus Sabate, Juergen Keller, Astrid Gollhardt, Dietmar Vogel, Isabel Gracia, Carles Cane, Joan Ramon Morante, Bernd Michel

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.608660

KEYWORDS: Sensors, Gas sensors, Reliability, Silicon, Platinum, 3D metrology, Temperature metrology, Digital image correlation, Atomic force microscopy, Scanning probe microscopy

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Proceedings Article | 9 May 2005 Paper

FIB based measurements for material characterization on MEMS structures

Dietmar Vogel, Daniel Lieske, Astrid Gollhardt, Juergen Keller, Neus Sabate, Joan Ramon Morante, Bernd Michel

Proceedings Volume 5766, (2005) https://doi.org/10.1117/12.599891

KEYWORDS: Digital image correlation, Ions, Scanning electron microscopy, Microelectromechanical systems, Ion beams, Material characterization, Image resolution, Sensors, Error analysis, Copper

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Proceedings Article | 9 May 2005 Paper

Nanoscale deformation measurements for reliability analysis of sensors

Juergen Keller, Astrid Gollhardt, Dietmar Vogel, Bernd Michel

Proceedings Volume 5770, (2005) https://doi.org/10.1117/12.600713

KEYWORDS: Sensors, Atomic force microscopy, Gas sensors, Scanning probe microscopy, Reliability, Digital image correlation, Platinum, Microelectromechanical systems, Infrared sensors, Temperature metrology

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Proceedings Article | 12 April 2005 Paper

Design methodology of microstructures for enhanced mechanical reliability

Olaf Wittler, Hans Walter, Dietmar Vogel, Juergen Keller, Bernd Michel

Proceedings Volume 5852, (2005) https://doi.org/10.1117/12.621978

KEYWORDS: Reliability, Computer aided design, Failure analysis, Platinum, Atomic force microscopy, Analytical research, Gas sensors, Microsystems, Copper, Modeling

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Proceedings Article | 12 April 2005 Paper

Vibration measurements on smart electronic structures by means of laser techniques

Norbert Ruemmler, Rene Schnitzer, Bernd Michel, Juergen Auersperg, Eberhard Kaulfersch

Proceedings Volume 5852, (2005) https://doi.org/10.1117/12.621542

KEYWORDS: Mirrors, Vibrometry, Sensors, Modal analysis, Reliability, Laser scanners, Micromirrors, Beam splitters, Product engineering, Shape analysis

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Proceedings Article | 12 April 2005 Paper

Deformation field measurement on micro and nanotechnology components utilizing SFM and FIB equipment

Dietmar Vogel, Juergen Keller, Astrid Gollhardt, Bernd Michel

Proceedings Volume 5852, (2005) https://doi.org/10.1117/12.621539

KEYWORDS: Atomic force microscopy, Digital image correlation, Sensors, Nanotechnology, Ions, Image resolution, Ion beams, Microsystems, Gas sensors, Platinum

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Proceedings Article | 1 September 2004 Paper

Structural health monitoring by embedded fiber Bragg gratings

Thomas Alt, Kathrin Badstuebner, Bernd Michel, A. Ansorge

Proceedings Volume 5459, (2004) https://doi.org/10.1117/12.544089

KEYWORDS: Fiber Bragg gratings, Sensors, Polymers, Structural health monitoring, Temperature metrology, Mechatronics, Packaging, Phase only filters, Stereolithography, Fiber optics sensors

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Proceedings Article | 21 July 2004 Paper

Characterization of microcracks by application of digital image correlation to SPM images

Juergen Keller, Astrid Gollhardt, Dietmar Vogel, Bernd Michel

Proceedings Volume 5392, (2004) https://doi.org/10.1117/12.538433

KEYWORDS: Digital image correlation, Scanning probe microscopy, Atomic force microscopy, Finite element methods, Reliability, Sensors, Gas sensors, Platinum, Microelectronics, Interfaces

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Proceedings Article | 21 July 2004 Paper

Characterization of materials with nanoscopic filler particles by AFM techniques

Dietmar Vogel, Juergen Keller, Bernd Michel

Proceedings Volume 5392, (2004) https://doi.org/10.1117/12.540073

KEYWORDS: Particles, Atomic force microscopy, Polymers, Polishing, Microscopy, Surface finishing, Image resolution, Composites, Scanning electron microscopy, Scanning probe microscopy

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Proceedings Article | 21 July 2004 Paper

Determination of Local Stress Intensity Factor at Crack Tip Using Image Correlation Techniques

Yi-Yang Tsai, Juergen Keller, Daniel Eylon, Dietmar Vogel, Bernd Michel, Norbert Meyendorf

Proceedings Volume 5392, (2004) https://doi.org/10.1117/12.538757

KEYWORDS: Aluminum, Microscopy, Atomic force microscopy, Polishing, Reliability, Diagnostics, Computed tomography, Scanning electron microscopy, Beam splitters, Ultrasonics

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Proceedings Article | 22 July 2003 Open Access

Evaluating microdefect structures by AFM-based deformation measurement

Dietmar Vogel, Juergen Keller, Astrid Gollhardt, Bernd Michel

Proceedings Volume 5045, (2003) https://doi.org/10.1117/12.483826

KEYWORDS: Atomic force microscopy, Sensors, Microelectromechanical systems, Photomicroscopy, Scanning electron microscopy, Reliability, Mechanics, Image resolution, Failure analysis, Digital image correlation

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Proceedings Article | 22 July 2003 Paper

International Center for Nano-Materials reliability

Norbert Meyendorf, Bernd Michel

Proceedings Volume 5045, (2003) https://doi.org/10.1117/12.483995

KEYWORDS: Reliability, Nanomaterials, Systems modeling, Safety, Manufacturing, Electronics, Complex systems, Information technology, Nanoelectromechanical systems, Nondestructive evaluation

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Proceedings Article | 16 July 2003 Paper

How to detect Edgar Allan Poe's 'purloined letter,' or cross-correlation algorithms in digitized video images for object identification, movement evaluation, and deformation analysis

Michael Dost, Dietmar Vogel, Thomas Winkler, Juergen Vogel, Rolf Erb, Eva Kieselstein, Bernd Michel

Proceedings Volume 5048, (2003) https://doi.org/10.1117/12.484373

KEYWORDS: Motion analysis, Video, Image processing, Homeland security, Nondestructive evaluation, Image resolution, Image analysis, Image acquisition, Biological research, Video processing

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Proceedings Article | 7 June 2002 Paper

Micro- and nano-DAC: a powerful technique for nondestructive microcrack evaluation

Bernd Michel, Dietmar Vogel

Proceedings Volume 4703, (2002) https://doi.org/10.1117/12.469623

KEYWORDS: Packaging, Photomicroscopy, Reliability, Microsystems, Atomic force microscopy, Scanning electron microscopy, Nondestructive evaluation, Microelectronics, Sensors, Temperature metrology

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Proceedings Article | 7 June 2002 Paper

Micro Materials Center Berlin: reliability research for MEMS

Bernd Michel, Thomas Winkler

Proceedings Volume 4703, (2002) https://doi.org/10.1117/12.469614

KEYWORDS: Reliability, Packaging, Microelectromechanical systems, Finite element methods, Microsystems, Microtechnology, Manufacturing, Composites, Polymers, Microelectronics

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Proceedings Article | 22 May 2002 Paper

Laser-based modal analysis of smart electronic structures

Rene Schnitzer, Norbert Ruemmler, Bernd Michel

Proceedings Volume 4827, (2002) https://doi.org/10.1117/12.468178

KEYWORDS: Modal analysis, Mirrors, Vibrometry, Micromirrors, Reliability, Beam splitters, Connectors, Electronic circuits, Laser scanners, Laser applications

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Proceedings Article | 19 April 2002 Paper

Micro/nano-DAC deformation measurement to analyze packaging components response to thermomechanical load

Dietmar Vogel, Astrid Gollhardt, Bernd Michel

Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462878

KEYWORDS: Packaging, Photomicroscopy, Reliability, Temperature metrology, Microelectromechanical systems, Silicon, Finite element methods, Polymers, Epoxies, Microopto electromechanical systems

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Proceedings Article | 19 April 2002 Paper

Damage-mechanic material characterization and structural finite element analysis of polymer encapsulation materials

Marcus Sonner, Peter Sprafke, Bernd Michel

Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462858

KEYWORDS: Polymers, Mechanics, Data modeling, Reliability, Material characterization, Finite element methods, Microsystems, Temperature metrology, Failure analysis, Astatine

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Proceedings Article | 19 April 2002 Paper

Parameterized FE-modeling and interfacial fracture toughness investigations towards reliability enhancements of advanced plastic packages

Juergen Auersperg, Rainer Dudek, Bernd Michel

Proceedings Volume 4755, (2002) https://doi.org/10.1117/12.462850

KEYWORDS: Reliability, Finite element methods, Interfaces, Manufacturing, Microelectromechanical systems, Mechanics, Microelectronics, Packaging, Optimization (mathematics), Failure analysis

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Proceedings Article | 30 October 2001 Paper

Characterization of electronic packaging materials and components by image correlation methods

Dietmar Vogel, Juergen Auersperg, Bernd Michel

Proceedings Volume 4596, (2001) https://doi.org/10.1117/12.447348

KEYWORDS: Atomic force microscopy, Scanning electron microscopy, Reliability, Image resolution, Photomicroscopy, Packaging, Temperature metrology, Electronic components, Silicon, Epoxies

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Proceedings Article | 11 November 1999 Paper

Strain measurement in micrometrology

Dietmar Vogel, Rolf Kuehnert, Bernd Michel

Proceedings Volume 3897, (1999) https://doi.org/10.1117/12.369312

KEYWORDS: Scanning electron microscopy, Moire patterns, Electronics, Packaging, Reliability, Temperature metrology, Microsystems, Image resolution, Mirrors, Finite element methods

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New generations of microelectronics and microsystem devices call for the utilization of a variety of new materials and the combination of materials with a widespread of their mechanical and thermal characteristics. Related thermo- mechanical reliability issues as well as functional aims bear a big challenge to understand and to design mechanical behavior of devices and components. Finite elements analysis of components and devices is widely utilized in the R and D process as a tool of predictive engineering. Unfortunately, uprising miniaturization, higher system complexity and advanced material application more often question mechanical modeling for simulation. So, a strong need exists to measure simultaneously stresses and strains on real components. At the IZM Berlin different classical kinds of laser methods have been used to determine deformation behavior of components due to thermo-mechanical load and functional performance of systems. The principal restriction of those methods with regard to spatial and measurement resolution had forced the development of new methods. In particular, microDAC a displacement and strain measurement method has been established. It bases on image processing algorithms permitting to extract strains form load state micrographs, which are picked up by SEM, optical microscopy and other high resolution imaging devices. Besides a brief review, corresponding interferometry and MicroMoire applications of the authors to micro deformation analysis, this paper mainly focuses on the microDAC technique. The basics of the microDAC concept, its main features like measurement resolution, data presentation and coupling to finite element analysis as well as applications are presented. Different kinds of measurements on modern electronics structures, like, e.g., used in flip chip technology, chip scale packaging and optoelectronics, illustrate its capability. Finally, a discussion of possible future developments is added, which can be directed to the adoption of higher resolution imaging equipment, namely scanning force microscopy.

Proceedings Article | 15 September 1999 Paper

Vibration measurement of microstructures by means of laser-optical modal analysis

Rene Schnitzer, Norbert Ruemmler, Volker Grosser, Bernd Michel

Proceedings Volume 3825, (1999) https://doi.org/10.1117/12.364305

KEYWORDS: Mirrors, Modal analysis, Sensors, Vibrometry, Micromirrors, Actuators, Shape analysis, Reliability, Environmental sensing, Laser interferometry

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Proceedings Article | 29 September 1998 Paper

Optical measurement methods for MEMS applications

Volker Grosser, C. Bombach, Wolf Faust, Dietmar Vogel, Bernd Michel

Proceedings Volume 3407, (1998) https://doi.org/10.1117/12.323337

KEYWORDS: Microelectromechanical systems, Microelectronics, Actuators, Interferometry, Optical testing, Reliability, Sensors, Mirrors, Microsystems, Optics manufacturing

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Proceedings Article | 6 July 1998 Paper

Mechanical properties of microsystem components

Bernd Michel, Dietmar Vogel, Volker Grosser

Proceedings Volume 3479, (1998) https://doi.org/10.1117/12.316443

KEYWORDS: Reliability, Microsystems, Interferometry, Microelectronics, Packaging, Laser optics, Scanning electron microscopy, Temperature metrology, Optical testing, Laser interferometry

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Proceedings Article | 30 November 1994 Paper

Strain and displacement measurements for microsystems technology

Dietmar Vogel, Rolf Kuehnert, Bernd Michel

Proceedings Volume 2342, (1994) https://doi.org/10.1117/12.195505

KEYWORDS: Speckle, Photography, Scanning electron microscopy, Capacitors, Correlation function, Algorithm development, Microsystems, Image resolution, Adhesives, Electronics

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Proceedings Article | 1 December 1991 Paper

Laser metrological measurement of transient strain fields in Hopkinson-bar experiments

Dietmar Vogel, Bernd Michel, Werner Totzauer, Ulrich Schreppel, Rainer Clos

Proceedings Volume 1554, (1991) https://doi.org/10.1117/12.49546

KEYWORDS: Wave propagation, Mechanics, Solids, Speckle, Birefringence, Digital image processing, Acoustics, Distortion, Image processing, Pulsed laser operation

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Showing 5 of 32 publications

Proceedings Volume Editor (7)

SPIE Conference Volume | 16 March 2006

Advanced Sensor Technologies for Nondestructive Evaluation and Structural Health Monitoring II

SPIE Conference Volume | 9 May 2005

Testing, Reliability, and Application of Micro- and Nano-Material Systems III

SPIE Conference Volume | 9 May 2005

Advanced Sensor Technologies for Nondestructive Evaluation and Structural Health Monitoring

SPIE Conference Volume | 21 July 2004

Testing, Reliability, and Application of Micro- and Nano-Material Systems II

SPIE Conference Volume | 22 July 2003

Testing, Reliability, and Application of Micro- and Nano-Material Systems

Showing 5 of 7 publications

Conference Committee Involvement (29)

Smart Structures and NDE for Industry 4.0, Smart Cities, and Energy Systems

27 April 2020 | Online Only, California, United States

Smart Structures and NDE for Energy Systems and Industry 4.0

4 March 2019 | Denver, Colorado, United States

Smart Materials and Nondestructive Evaluation for Energy Systems IV

5 March 2018 | Denver, Colorado, United States

Smart Materials and Nondestructive Evaluation for Energy Systems III

27 March 2017 | Portland, Oregon, United States

Smart Materials and Nondestructive Evaluation for Energy Systems

9 March 2015 | San Diego, California, United States

Smart Sensor Phenomena, Technology, Networks, and Systems Integration VII

10 March 2014 | San Diego, California, United States

Smart Sensor Phenomena, Technology, Networks, and Systems Integration VI

10 March 2013 | San Diego, California, United States

Smart Sensor Phenomena, Technology, Networks, and Systems Integration V

12 March 2012 | San Diego, California, United States

Smart Sensor Phenomena, Technology, Networks, and Systems IV

7 March 2011 | San Diego, California, United States

Smart Sensor Phenomena, Technology, Networks, and Systems III

8 March 2010 | San Diego, California, United States

Smart Sensor Phenomena, Technology, Networks, and Systems II

9 March 2009 | San Diego, California, United States

Nanosensors and Microsensors for Bio-Systems

11 March 2008 | San Diego, California, United States

Smart Sensor Phenomena, Technology, Networks, and Systems

10 March 2008 | San Diego, California, United States

Nano-, Micro- and Bio-Sensors and Systems

21 March 2007 | San Diego, California, United States

Sensor Systems and Networks: Phenomena, Technology and Applications for NDE and Health Monitoring

19 March 2007 | San Diego, California, United States

Testing, Reliability, and Application of Micro- and Nano-Material Systems IV

1 March 2006 | San Diego, CA, United States

Advanced Sensor Technologies for NDE and Structural Health Monitoring II

1 March 2006 | San Diego, CA, United States

Nonintrusive Inspection, Structures Monitoring, and Smart Systems for Homeland Security

27 February 2006 | San Diego, CA, United States

Advanced Sensor Technologies for Nondestructive Evaluation and Structural Health Monitoring

9 March 2005 | San Diego, CA, United States

Testing, Reliability, and Application of Micro- and Nano-Material Systems III

9 March 2005 | San Diego, CA, United States

Nondestructive Detection and Measurement for Homeland Security III

7 March 2005 | San Diego, CA, United States

Nondestructive Detection and Measurement for Homeland Security II

17 March 2004 | San Diego, CA, United States

Testing, Reliability, and Application of Micro-and Nano-Material Systems II

15 March 2004 | San Diego, CA, United States

Nondestructive Detection and Measurement for Homeland Security

4 March 2003 | San Diego, California, United States

Testing, Reliability, and Application of Micro- and Nano-Material Systems

3 March 2003 | San Diego, California, United States

Thermo-mechanical Issues in Packaging and Assembly of MEMS and MOEMS

28 October 2002 | Bruges, Belgium

Design, Test, Integration and Packaging of MEMS/MOEMS 2002

19 March 2002 | Cannes-Mandelieu, France

Nondestructive Evaluation and Reliability of Micro- and Nanomaterial Systems

18 March 2002 | San Diego, California, United States

Design, Test, Integration, and Packaging of MEMS/MOEMS

9 May 2000 | Paris, France

Showing 5 of 29 Conference Committees

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