Flexible scalable photonic manufacturing method

Timothy A. Skunes; Steven K. Case

doi:10.1117/12.475475

30 May 2003 Flexible scalable photonic manufacturing method

Timothy A. Skunes, Steven K. Case

Proceedings Volume 4997, Photonics Packaging and Integration III; (2003) https://doi.org/10.1117/12.475475
Event: Integrated Optoelectronics Devices, 2003, San Jose, CA, United States

Abstract

A process for flexible, scalable photonic manufacturing is described. Optical components are actively pre-aligned and secured to precision mounts. In a subsequent operation, the mounted optical components are passively placed onto a substrate known as an Optical Circuit Board (OCB). The passive placement may be either manual for low volume applications or with a pick-and-place robot for high volume applications. Mating registration features on the component mounts and the OCB facilitate accurate optical alignment. New photonic circuits may be created by changing the layout of the OCB. Predicted yield data from Monte Carlo tolerance simulations for two fiber optic photonic circuits is presented.

Citation Download Citation

Timothy A. Skunes and Steven K. Case "Flexible scalable photonic manufacturing method", Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); https://doi.org/10.1117/12.475475

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