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Oliver Scholz
at Fraunhofer ZV
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Publications (1)
Proceedings Article | 22 July 2003 Paper
In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering
Oliver Scholz, Michael Eisenbarth, Randolf Hanke, Thomas Bigl, Peter Schmitt
Proceedings Volume 5045, (2003) https://doi.org/10.1117/12.484664
KEYWORDS: X-rays, Integrated circuits, X-ray imaging, Detection and tracking algorithms, Inspection, Reliability, Manufacturing, Tomography, 3D image processing, Spherical lenses
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