Paper
29 April 2003 Large-scale integration of carbon nanotubes into silicon-based microelectronics
Georg S. Duesberg, Andrew P. Graham, Maik Liebau, Robert Seidel, Eugen Unger, Franz Kreupl, Wolfgang Hoenlein
Author Affiliations +
Proceedings Volume 5118, Nanotechnology; (2003) https://doi.org/10.1117/12.499414
Event: Microtechnologies for the New Millennium 2003, 2003, Maspalomas, Gran Canaria, Canary Islands, Spain
Abstract
The integration of carbon nanotubes (CNTs) into conventional silicon-technology with potential applications as interconnects, transistors, memory-cells, and sensors is an promising goal. Theoretical and experimental results indicate that CNT-based devices can outperform conventional silicon microelectronics. Concepts for the creation of vertical interconnects and transistors made out of CNTs, which allow a large scale integration, are presented. A vital step for their realization is the synthesis of individual CNTs with controlled diameters at lithographically predefined locations. Employing catalyst mediated Chemical Vapor Deposition (CVD) isolated CNTs have been grown out of holes in silicon dioxide which have been created by optical lithography. This allows the precise placement of individual CNTs on silicon substrates. Furthermore, the diameter of each CNT adjusts to the hole size, which makes it possible to control this important property separately for individual CNTs. In combination with the vertical integration concept those findings constitute a milestone in the parallel manufacture of nanotube-based devices with scalable batch processes.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Georg S. Duesberg, Andrew P. Graham, Maik Liebau, Robert Seidel, Eugen Unger, Franz Kreupl, and Wolfgang Hoenlein "Large-scale integration of carbon nanotubes into silicon-based microelectronics", Proc. SPIE 5118, Nanotechnology, (29 April 2003); https://doi.org/10.1117/12.499414
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Cited by 3 scholarly publications.
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KEYWORDS
Silicon

Chemical vapor deposition

Transistors

Carbon nanotubes

Microelectronics

Particles

Scanning electron microscopy

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