eMET: 50 keV electron mask exposure tool development based on proven multi-beam projection technology

Elmar Platzgummer; Stefan Cernusca; Christof Klein; Jan Klikovits; Samuel Kvasnica; Hans Loeschner

doi:10.1117/12.864261

29 September 2010 eMET: 50 keV electron mask exposure tool development based on proven multi-beam projection technology

Elmar Platzgummer, Stefan Cernusca, Christof Klein, Jan Klikovits, Samuel Kvasnica, Hans Loeschner

Proceedings Volume 7823, Photomask Technology 2010; 782308 (2010) https://doi.org/10.1117/12.864261
Event: SPIE Photomask Technology, 2010, Monterey, California, United States

Abstract

Multi-beam writing becomes mandatory for future technology nodes in order to stay within reasonable realization times for leading-edge complex masks and templates. IMS Nanofabrication has developed multi-beam projection techniques implementing a programmable aperture plate system (APS) and charged-particle projection optics with 200x reduction. Proof-of-concept of multi-beam writing on static substrates was demonstrated in 2009 using the CHARPAN tool with 10keV ion multi-beams and the RIMANA tool with 50keV electron multi-beams. For the first time projection multibeam writing on moving substrates is presented as made achievable by upgrading the CHARPAN Tool with a laserinterferometer controlled stage to realize a POWS (Proof-Of-Writing-Strategy) tool configuration. With the RIMANA Tool 50keV e-beam exposures of ILT (Inverse Lithography Technique) patterns are demonstrated.. The status of the development of a 50keV electron Mask Exposure Tool (eMET) is presented and the targeted writing speeds of eMET POC and eMET HVM systems are outlined.

Citation Download Citation

Elmar Platzgummer, Stefan Cernusca, Christof Klein, Jan Klikovits, Samuel Kvasnica, and Hans Loeschner "eMET: 50 keV electron mask exposure tool development based on proven multi-beam projection technology", Proc. SPIE 7823, Photomask Technology 2010, 782308 (29 September 2010); https://doi.org/10.1117/12.864261

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