Paper
18 March 2016 Improvements to the analytical linescan model for SEM metrology
Author Affiliations +
Abstract
Critical dimension scanning electron microscope (CD-SEM) metrology has long used empirical approaches to determine edge locations. While such solutions are very flexible, physics-based models offer the potential for improved accuracy and precision for specific applications. Here, Monte Carlo simulation is used to generate theoretical linescans from single step and line/space targets in order to build a physics-based analytical model, including the presence of bottom footing and top corner rounding. The resulting analytical linescan model fits the Monte Carlo simulation results for different feature heights, widths, pitches, sidewall angles, bottom footing, and top corner rounding. This model has also been successfully applied to asymetric features such as sidewall spacers encountered in self-aligned double patterning.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chris A. Mack and Benjamin D. Bunday "Improvements to the analytical linescan model for SEM metrology", Proc. SPIE 9778, Metrology, Inspection, and Process Control for Microlithography XXX, 97780A (18 March 2016); https://doi.org/10.1117/12.2218443
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CITATIONS
Cited by 7 scholarly publications and 1 patent.
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KEYWORDS
Monte Carlo methods

Scanning electron microscopy

Silicon

Semiconducting wafers

Finite element methods

Neodymium

Electroluminescence

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