Dr. Chandana Yellampalli Profile

Dr. Chandana Yellampalli

Research Student at Indian Institute of Technology

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 15 January 2003 Paper

Optimization of EDP solutions for feature-size-independent silicon etching

Chandana Yellampalli, Kunchinadka Bhat, Nandita DasGupta, Amitava DasGupta, Parimi Rao

Proceedings Volume 4979, (2003) https://doi.org/10.1117/12.478257

KEYWORDS: Etching, Silicon, Semiconducting wafers, Surface finishing, Anisotropic etching, Oxygen, Oxides, Crystals, Diffusion, Oxidation

Read Abstract +

The etching of single crystal silicon in ethylenediamine-pyrocatechol-water solutions (EDP) has been studied as a function of the composition of the etching solution. The solution with a constant composition of 7.5ml of ethylenediamine (with 6g of pyrazine per liter) and 1.2g of pyrocatechol is used, and the water content is varied from 0ml to 4ml. Etch rate dependence on the active etching area is examined using three mask patterns having significantly different areas. It has been observed that etch rate depends significantly on the feature size in the solutions with higher water concentration and is almost independent of the area when the water content is 1ml and below. Surface morphology was the other important criteria considered while optimizing the solution. It is found that the hillocks formation on surface is dependent on the etchant composition. Hillock density has been measured by etching the samples in different compositions to a constant depth of 45μm. It is found to be high when the water content is above 2ml and also when the amount of water is reduced below 0.5ml. Minimal Hillock density is obtained when the water content is 0.5ml. The optimized EDP solution containing 0.5ml of water results in an etch rate of 44μm/hr, independent of feature size and also good surface finish with hillock density less than ~10³/cm².

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years