Proceedings Article | 8 November 2005
KEYWORDS: Optical proximity correction, Databases, Inspection, Manufacturing, Data modeling, Model-based design, Optical lithography, Semiconducting wafers, Design for manufacturability, Photomasks
In this paper, we evaluated and investigated techniques for performing fast full-chip post-OPC verification using a commercial product platform. A number of databases from several technology nodes, i.e. 0.13um, 0.11um and 90nm are used in the investigation. Although it has proven that for most cases, our OPC technology is robust in general, due to the variety of tape-outs with complicated design styles and technologies, it is difficult to develop a "complete or bullet-proof" OPC algorithm that would cover every possible layout patterns. In the evaluation, among dozens of databases, some OPC databases were found errors by Model-based post-OPC checking, which could cost significantly in manufacturing - reticle, wafer process, and more importantly the production delay. From such a full-chip OPC database verification, we have learned that optimizing OPC models and recipes on a limited set of test chip designs may not provide sufficient coverage across the range of designs to be produced in the process. And, fatal errors (such as pinch or bridge) or poor CD distribution and process-sensitive patterns may still occur. As a result, more than one reticle tape-out cycle is not uncommon to prove models and recipes that approach the center of process for a range of designs. So, we will describe a full-chip pattern-based simulation verification flow serves both OPC model and recipe development as well as post OPC verification after production release of the OPC. Lastly, we will discuss the differentiation of the new pattern-based and conventional edge-based verification tools and summarize the advantages of our new tool and methodology: 1). Accuracy: Superior inspection algorithms, down to 1nm accuracy with the new "pattern based" approach 2). High speed performance: Pattern-centric algorithms to give best full-chip inspection efficiency 3). Powerful analysis capability: Flexible error distribution, grouping, interactive viewing and hierarchical pattern extraction to narrow down to unique patterns/cells.
