High power diode lasers have been widely used in many fields. To meet the requirements of high power and high reliability, passively cooled single bar CS-packaged diode lasers must be robust to withstand thermal fatigue and operate long lifetime. In this work, a novel complete indium-free double-side cooling technology has been applied to package passively cooled high power diode lasers. Thermal behavior of hard solder CS-package diode lasers with different packaging structures was simulated and analyzed. Based on these results, the device structure and packaging process of double-side cooled CS-packaged diode lasers were optimized. A series of CW 200W 940nm high power diode lasers were developed and fabricated using hard solder bonding technology. The performance of the CW 200W 940nm high power diode lasers, such as output power, spectrum, thermal resistance, near field, far field, smile, lifetime, etc., is characterized and analyzed.
A novel marco channel cooler (MaCC) has been developed for packaging high power diode vertical stacked (HPDL) lasers, which eliminates many of the issues in commercially-available copper micro-channel coolers (MCC). The MaCC coolers, which do not require deionized water as coolant, were carefully designed for compact size and superior thermal dissipation capability. Indium-free packaging technology was adopted throughout product design and fabrication process to minimize the risk of solder electromigration and thermal fatigue at high current density and long pulse width under QCW operation. Single MaCC unit with peak output power of up to 700W/bar at pulse width in microsecond range and 200W/bar at pulse width in millisecond range has been recorded. Characteristic comparison on thermal resistivity, spectrum, near filed and lifetime have been conducted between a MaCC product and its counterpart MCC product. QCW lifetime test (30ms 10Hz, 30% duty cycle) has also been conducted with distilled water as coolant. A vertical 40-MaCC stack product has been fabricated, total output power of 9 kilowatts has been recorded under QCW mode (3ms, 30Hz, 9% duty cycle).
9xx nm CW mini-bar diode lasers and stacks with high brightness and reliability are desired for pumping fiber lasers and direct fiber coupling applications. For the traditional cm-bar with 1mm-2mm cavity, it can provide CW output power up to 80W-100W and high reliability, whereas the brightness is relatively low. In comparison, mini-bar based diode lasers with 4mm cavity offer a superior performance balance between power, brightness, and reliability. However, the long cavity and large footprint of mini-bar diode laser renders its sensitivity towards thermal stress formed in packaging process, which directly affects the performances of high bright mini-bar diode lasers. In this work, the thermal stress correlating with package structure and packaging process are compared and analyzed. Based on the experiment and analysis results, an optimized package structure of CW 60W 976 nm mini-bar diode lasers is designed and developed which relieves thermal stress.
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