X-ray optics, such as e.g. for ESA’s ATHENA (Advanced Telescope for High-ENergy Astrophysics) mission, often require that their alignment takes places under vacuum conditions, in particular when high precision and the compensation for vacuum-related distortion states is mandatory. In order to fixate the alignment state, standard bonding technologies for x-ray optics, such as clamping or adhesive bonding, only can be carried out at ambient conditions, causing a potential change of the alignment state when transiting from ambient condition to vacuum. In a study issued by ESA, the use of a specific laser-based soldering technology to be carried out under vacuum conditions was successfully conducted. The socalled “Solderjet Bumping” (SJB) technology combines solder alloy preform singulation and handling as well as laserbased reflow and placement at the desired, metallized bonding areas for x-ray optics. Achieving de-alignment less than a millirad during soldering under <1e-4 mbar vacuum condition is reported for complex and 3D x-ray optics geometries. Also, ca. twice the bonding strength was reached, compared to adhesive bonds carried out at ambient conditions.
Laser-based soldering, also known as Solderjet-bumping, is an established process for the bonding of optical and mechanical components under laboratory conditions at normal atmosphere.
The present study shows the implementation and adaption of the bonding technology to a vacuum environment with pressure below 10-4 mbar, in which x-ray optics are assembled and aligned. To demonstrate the performance, assembly campaigns for x-ray optics demonstrators in air and under vacuum conditions were performed. Environmental and mechanical tests on sample-level-studies were carried out.
The results of the study show that the solderjet-bumping technique is capable for the bonding of x-ray optics and other components under vacuum conditions. The strength of the bond is not affected by the vacuum environment.
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