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Dr. Gil Zilber
at ShellCase Ltd
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Author
Publications (1)
Proceedings Article | 28 September 2001 Paper
Integrated cavity wafer level chip size package for MEMS applications
Danny Weiss, Doron Teomim, Avner Badihi, Gil Zilber
Proceedings Volume 4557, (2001) https://doi.org/10.1117/12.442942
KEYWORDS: Microelectromechanical systems, Semiconducting wafers, Packaging, Glasses, Silicon, Manufacturing, Epoxies, Semiconductors, Lead, Micromirrors
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