In this paper, we demonstrate near-C-band semiconductor optical amplifiers (SOAs) integrated on silicon photonic chips using photonic wire bonds (PWBs). PWBs are three-dimensional, nano-printed, freeform, polymer waveguides which provide efficient coupling between optical components. The SOAs used in this work were 975μm long and 400μm wide, with a 1.54μm wide, 1.9μm thick active region. Measurements on a connectorized SOA are presented, showing a peak on-chip gain of 10.6dB at 1510nm when applying a 150mA bias current to it (here we have not calibrated out the coupling losses at the two SOI-waveguide/PWB interfaces nor have we calibrated out the losses at the two PWB/SOA interfaces, indicating that the gain of the SOA is significantly higher than the measured 10.6dB). The PWB connectorized SOA has a wavelength-dependent gain which was measured from 1480nm to 1555nm, the peak gain being obtained at 1510nm. In addition, the gain depends on the bias current applied, increasing with higher bias currents but saturating when the bias current exceeds 150mA. The PWB-connectorized SOA is also sensitive to the power of the input signal, the gain was larger for lower input powers (i.e., for powers below about -4.9dBm). Varying the polarization state of the input to our PWB-connectorized SOA changed the measured gain by 5.85dB.
The goal of SiEPICfab is to conduct research in the fabrication of silicon photonic devices and photonic integrated circuits, and to make leading-edge silicon photonic manufacturing accessible to Canadian and international academics and industry. SiEPICfab builds on the success of the Silicon Electronic Photonic Integrated Circuits (SiEPIC) program, which has been offering research training workshops since 2008, by adding a fabrication facility “fab”. We have developed a rapid prototyping facility to support a complete ecosystem of companies involved in silicon photonics product development, including modelling, design, library development, fabrication, test, and packaging of silicon photonics. SiEPICfab allows designers to rapidly complete design-fabricate-test cycles, with technologies such as sub-wavelength sensors, PN junction ring modulators, silicon defect-based detectors, single photon detectors, single photon sources, and photonic wire bond integration of lasers and optical fibres.
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