Radio Frequency Identification (RFID) systems have become more and more popular in the last few years because
of their wide application fields, such as supply chain management and logistics. To continue their development further
investigations of new conductive materials for fabrication of RFID transponders’ antennas are necessary to be carried
out. These materials should provide high flexibility and good radiation performance of printed antennas.
In this paper, two polymer silver pastes based on silver flakes were characterized with regard to manufacturing of
flexible RFID antennas with screen printing technique. Foil and paper were used as a substrate materials. Surface
profile of the printed antennas was measured using an optical profilometer and their resistance was measured with
a four-point-probe method. Antenna flexibility was evaluated in cyclic bending tests and its performance with reflection
coefficient measurements with the use of differential probe connected to a vector network analyzer. In addition,
a maximum read distance of a fabricated RFID transponder was measured.
Hybrid microelectronics modules fabricated on LTCC (Low Temperature Co-fired Ceramic) substrates are most used in aerospace, automotive and medical industry. Microelectronics modules on LTCC substrates are common application for sensors in ABS or Air Bags systems. High scale of circuit integration and possibility to combine different types of elements and mounting techniques are factor which drags attention of Research Laboratories to develop new generations of hybrid microelectronics modules and new technologies of their fabrication. In the paper new method of fabrication hybrid microelectronic modules on LTCC substrates using Inkjet printing technique is describe. In particular latest achievements of Inkjet printed high resolutions circuits on unfired LTCC foil were presented. Paper also include unprecedented method of filing VIA (Vertical Electrical Connections) using developed in Tele & Radio Research Institute Inkjet printing System. Problems in fabrication hybrid microelectronic modules on LTCC substrates, in particular with screen printing electrical connections and VIA holes filing were discussed. Advantages of proposed new method of fabrication electric connections using Inkjet printing on LTCC substrates were given and possible areas of application were discussed.
This work shows in details the design and performance of precise ink jet printing system which has been constructed for organic electronic technology analysis. The printing system was designed for laboratory investigation of inks and substrates compatibility. Printing system has been tested by its precision and abilities by fabrication electronic elements. PEDOT: PSS, Sun Tronic U6415, Nano silver based inks were tested. Glass, alumina ceramic, PEN foil and paper were tested as substrates. Printer was design in order to solve disadvantages of commercial systems. It has improved software with user friendly graphic interface, improved accuracy and precision. New drop watch solution has been develop. In the investigation, compatibility of materials and inks was tested. Methods of making inks and substrates compatible, by setting the substrate temperature, ink jet printhead voltage and geometry, were studied. Printed lines after sintering process become conductive. Ohmic resistance of lines was measured and their quality was evaluated.
Organic electronics is a platform technology that enables multiple applications based on organic electronics but varied in
specifications. Organic electronics is based on the combination of new materials and cost-effective, large area production
processes that provide new fields of application.
Organic electronic by its size, weight, flexibility and environmental friendliness electronics enables low cost production
of numerous electrical components and provides for such promising fields of application as: intelligent packaging, low
cost RFID, flexible solar cells, disposable diagnostic devices or games, and printed batteries [1].
The paper presents results of inkjetted electronics elements on flexible and glass substrates. The investigations was target
on characterizing shape, surface and geometry of printed structures. Variety of substrates were investigated, within some,
low cost, non specialized substrate, design for other purposes than organic electronic.
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