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Motoya Okazaki
at Applied Materials Inc
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Publications (1)
Proceedings Article | 25 March 2008 Paper
Wafer edge polishing process for defect reduction during immersion lithography
Motoya Okazaki, Raymond Maas, Sen-Hou Ko, Yufei Chen, Paul Miller, Mani Thothadri, Manjari Dutta, Chorng-Ping Chang, Abraham Anapolsky, Chris Lazik, Yuri Uritsky, Martin Seamons, Deenesh Padhi, Wendy Yeh, Stephan Sinkwitz, Chris Ngai
Proceedings Volume 6922, 69223A (2008) https://doi.org/10.1117/12.773113
KEYWORDS: Semiconducting wafers, Polishing, Immersion lithography, Particles, Lithography, Inspection, Surface finishing, Manufacturing, Etching, Chemistry
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