A pulse laser of ultraviolet region was used to form the flow path and so on. Numbers of heat-hardening resin-films and
fluoro resins were piled up a soda glass. A laser fabricated a part of the channel at the each film every lamination, and
then 3-D structure micro-channel was fabricated. The channel sizes are widths of 10-400&mgr;m and depths of 30-90&mgr;m.
Moreover through holes as artificial capillary-vessels are made in the resin having a minimum diameter of 5 &mgr;m and a
length of 100 &mgr;m. As bloods were injected into a particle focusing micro-channel, an artificial capillary-vessel, and a
micro-separator, then cell sort, erythrocyte deformability, and blood plasma were observed with a microscope,
respectively.
A YAG laser of 266 nm is focused just above or at the surface of a Ni substrate in a near critical CO2 chamber. Since the compressibility of CO2 becomes very high, strong shock waves may be produced by laser irradiation. We are going to investigate the dependence of the nano structures for nickel and CO2 on the laser power and the focus point. After the laser radiation, we found fine grains on the Ni substrate with a scanning electron microscopy and energy dispersive X-ray spectroscopy.
This paper describes the fabrication of micro-channels in resin for micro-fluidic devices such as the μ-TAS (Micro Total Analysis System) by a UV laser ablation. Numbers of heat-hardening resin-films are piled up a soda glass. A laser fabricates a part of the channel at the each film every lamination, and then 3-D confluence channels are fabricated. The channel sizes are widths of 20 - 150 μm and depths of 20 - 30 μm. The through holes are made in the laminate film by the laser. Inlet pipe for a micro-pump are inserted into the hole. Deionized water is injected into the channels with a microinjection pump. This flow rate is 5 μL/min. There is no damage to the channel, inlet, and outlet.
This paper describes the fabrication of micro-channels in resin for micro-fluidic devices by a UV laser. Quartz wafers are coated with a 20μm thick BCB resin. Micro-grooves for micro-channels are fabricated into the BCB resin by a KrF excimer laser. The groove bottom is 100m wide at a pulse width of 20nsec, fluence of 1.3mJ/cm2/pulse, and overlap of 98.9%. The wafer surface serves as the bottom face of the groove. Moreover the side wall angle is 72°. Furthermore, the grooves are covered with laminate films to prevent leakage of the liquid samples. A thermoplastic film or a heat-hardening resin film is used as a laminate film. Laminating conditions are: roller temperatures of 120°C, pressure of 0.8MPa, and laminating speed of 0.2m/min. The thermoplastic film coats the groove perfectly. On the contrary, the heat-hardening film does not sag into the groove, resulting in an open-are cross-sectional ration of 80%. Furthermore, the open-area-ratio becomes 100% through a heat-curing process at a temperature of 120°C for 30min. The through holes are made in the laminate film by a KrF excimer laser. Inlet pipe for a micro-pump are inserted into the hole.
Using a 1.06 μm wavelength YAG laser, we have produced holes in glass-foam substrates. We have used three types of glass-foam made from 1-mm-thick quartz. The first type, called S1, contains 5% foam ranging in size from 2.0-50 μm. The second type, called S2, contains foam ranging in size from 0.1-0.5 μm. The third type, called S3, contains 12% foam ranging in size from 100-200 μm. We have drilled holes in these three types of glass-foam at pulse widths of 0.5-1.2msec and power of 0.5-3.0J. Only the S1 substrate is capable of creating a through hole at a power up to 0.8J. The height of the pile-up increases 15-40 μm with increasing power. The S1 substrate has better machinability than S2 and S3. The S1 substrate is suitable for laser beam machining.
Using 10 - 100 msec pulses and a 10.6 micrometers wavelength CO2 laser, focused to a spot size 200 micrometers , we have produced holes into glass-foam substrates. We examine the effect of pulse width on the hole structure and the pile-up around the hole in single-pulse drilling. The height of the pile-up increases 7 - 30 micrometers with increasing the pulse width. The residual melting layer is under 0.5 (mu) m in the hole walls. It seems that the glass-foam substrate is suitable for laser beam machining.
Using 30-1000 (mu) s pulses and 9.3 (mu) m wavelength from a CO2 slab waveguide laser, focused to a spot size of 130 (mu) m, we have produced holes in synthetic quartz, soda-lime glass, and Pyrex glass substrates. In the three types of substrates, the mass removal per pulse increases almost linearly with the pulse energy used to vary the pulse interval. The removal rates of the three substrates are almost the same. We examine the effect of the pulse interval on the hole structure and the pile-up around the hole in single- and multiple-pulse hole drilling. The deformation on the pile-up region can be accounted by the melting walls of the hole. Moreover, we examine the effect of pulse energy on the inclination of the hole walls. A multiple-pulse hole shaping technique is effective in decreasing the height coefficient of the pile-up region and the angle of inclination.
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