The semiconductor industry is growing at an annual rate of 6.9%, and the production of semiconductor devices is increasing accordingly. Currently, device manufacturing using Extreme Ultraviolet (EUV), referred to as 2 nm technology, has begun for AI and mobile phone devices. On the other hand, the production of devices using >90nm technology, known as mainstream, for the automobile industry and sensing devices, including power, analog, and discrete, is also increasing, leading to an increase in the production of photomasks. However, the reality is that the production of photomasks for the relevant technology is using outdated equipment, and there is a need for equipment with high productivity. In this study, we investigate how e-beam masks for devices used in the mainstream technology compares to masks manufactured with current high-productivity DUV laser equipment and will focus on the following aspects and provide a comprehensive report. Comparison with manufactured masks based on current technologies in terms of CDU, Registration, resolution, printability and so on.
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