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31 July 2023 Parallel MEMS AFM for high-throughput semiconductor metrology and inspection (Erratum)
Zhenle Cao, Wyatt Sullivan, Benjamin D. Bunday, David Morris
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Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124963Q (2023) https://doi.org/10.1117/12.3005374
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States
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Publisher's Note: This paper, originally published on 27 April 2023, was replaced with a corrected/revised version on 31 July 2023. If you downloaded the original PDF but are unable to access the revision, please contact SPIE Digital Library Customer Service for assistance.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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Zhenle Cao, Wyatt Sullivan, Benjamin D. Bunday, and David Morris "Parallel MEMS AFM for high-throughput semiconductor metrology and inspection (Erratum)", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124963Q (31 July 2023); https://doi.org/10.1117/12.3005374
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KEYWORDS
Inspection
Metrology
Atomic force microscopy
Microelectromechanical systems
Semiconductors
Advanced process control
Lithography
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