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30 April 2023 Dry resist patterning readiness towards high-NA EUV lithography
Hyo Seon Suh, Danilo De Simone, Christophe Beral, Mihir Gupta, Nadia Vandenbroeck, Anuja De Silva, Ali Haider, Ching-Chung Huang, Mohand Brouri, Francesco Gullo, Shruti Jambaldinni, Benjamin Kam, Hicham Zaid, Elisseos Verveniotis, Samantha Tan, Tim Weidman, Jengyi Yu, Da Li, Jun Xue, Younghee Lee
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Proceedings Volume 12498, Advances in Patterning Materials and Processes XL; 1249803 (2023) https://doi.org/10.1117/12.2661652
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States
Abstract
In this work, we aim to demonstrate the progress of dry resist development to address specific challenges of high NA EUV lithography. As features scales, resist thickness and interface between resist and underlayer play a crucial role. The co-optimization of underlayers with dry technology enables tuning of the patterning stack for optimal performance. Dry deposition of resists offers precise control over thickness and composition to improve material variability. Dry development reduces the likelihood of pattern collapse and enhances the ability to print features at higher aspect ratio. Defect characterization at pitch 28nm test vehicles at imec have been used to validate the material and process improvements in the dry resist program. Furthermore, dry resist patterning performance at pitch 24nm dense line-space and pitch 34nm hexagonal dense pillars and contact holes will be discussed showing the readiness towards the high NA EUV patterning.
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Hyo Seon Suh, Danilo De Simone, Christophe Beral, Mihir Gupta, Nadia Vandenbroeck, Anuja De Silva, Ali Haider, Ching-Chung Huang, Mohand Brouri, Francesco Gullo, Shruti Jambaldinni, Benjamin Kam, Hicham Zaid, Elisseos Verveniotis, Samantha Tan, Tim Weidman, Jengyi Yu, Da Li, Jun Xue, and Younghee Lee "Dry resist patterning readiness towards high-NA EUV lithography", Proc. SPIE 12498, Advances in Patterning Materials and Processes XL, 1249803 (30 April 2023); https://doi.org/10.1117/12.2661652
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KEYWORDS
Optical lithography
Extreme ultraviolet lithography
Extreme ultraviolet
Photoresist processing
Interfaces
Materials processing
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