New chemistry in the design of chemically amplified positive resists

Robert D. Allen; Quan P. Ly; Gregory M. Wallraff; Carl E. Larson; William D. Hinsberg; Will Conley; Karl Paul Muller

doi:10.1117/12.154758

15 September 1993 New chemistry in the design of chemically amplified positive resists

Robert D. Allen, Quan P. Ly, Gregory M. Wallraff, Carl E. Larson, William D. Hinsberg, Will Conley, Karl Paul Muller

Proceedings Volume 1925, Advances in Resist Technology and Processing X; (1993) https://doi.org/10.1117/12.154758
Event: SPIE'S 1993 Symposium on Microlithography, 1993, San Jose, CA, United States

Abstract

The quest for high performance positive deep-UV resist is a significant challenge. In this paper we discuss a new approach to chemically amplified positive resists involving the use of a new and versatile class of polymeric dissolution inhibitors. Methacrylate terpolymers originally designed as chemically amplified positive resists for printed circuit board technology have been found to form stable, one-phase mixtures with a variety of phenolic resins. These new dissolution inhibitors based on MMA-TBMA-MAA terpolymers have unusual and useful properties, including excellent optical transmission at 248 nm, high glass transition temperatures, and dissolution inhibition/promotion power which can be tailored to accommodate the dissolution properties of the particular phenolic resin being used.

Citation Download Citation

Robert D. Allen, Quan P. Ly, Gregory M. Wallraff, Carl E. Larson, William D. Hinsberg, Will Conley, and Karl Paul Muller "New chemistry in the design of chemically amplified positive resists", Proc. SPIE 1925, Advances in Resist Technology and Processing X, (15 September 1993); https://doi.org/10.1117/12.154758

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