Kill ratio calculation for in-line yield prediction

Alfonso Lorenzo; David Oter; Sergio Cruceta; Juan Francisco Valtuena; Gerardo Gonzalez; Carlos Mata

doi:10.1117/12.346923

27 April 1999 Kill ratio calculation for in-line yield prediction

Alfonso Lorenzo, David Oter, Sergio Cruceta, Juan Francisco Valtuena, Gerardo Gonzalez, Carlos Mata

Proceedings Volume 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing; (1999) https://doi.org/10.1117/12.346923
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom

Abstract

The search for better yields in IC manufacturing calls for a smarter use of the vast amount of data that can be generated by a world class production line.In this scenario, in-line inspection processes produce thousands of wafer maps, number of defects, defect type and pictures every day. A step forward is to correlate these with the other big data- generator area: test. In this paper, we present how these data can be put together and correlated to obtain a very useful yield predicting tool. This correlation will first allow us to calculate the kill ratio, i.e. the probability for a defect of a certain size in a certain layer to kill the die. Then we will use that number to estimate the cosmetic yield that a wafer will have.

Citation Download Citation

Alfonso Lorenzo, David Oter, Sergio Cruceta, Juan Francisco Valtuena, Gerardo Gonzalez, and Carlos Mata "Kill ratio calculation for in-line yield prediction", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); https://doi.org/10.1117/12.346923

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