CONFERENCE PROCEEDINGS
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Dr. Jiahui Wang
at imec
SPIE Involvement:
Author
Publications (5)
Proceedings Article | 10 April 2024 Presentation + Paper
EUV lithography: LER design, mask, and wafer impact
Jiahui Wang, Emily Gallagher, Jeroen Van de Kerkhove, Rik Jonckheere, Darko Trivkovic
Proceedings Volume 12953, 129530A (2024) https://doi.org/10.1117/12.3011038
KEYWORDS: Line edge roughness, Semiconducting wafers, Design, Tunable filters, Light sources and illumination, Extreme ultraviolet lithography, Scanning electron microscopy, Scanners, Optical filters, Image analysis
Proceedings Article | 28 April 2023 Poster + Paper
Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV
Proceedings Volume 12495, 124951U (2023) https://doi.org/10.1117/12.2658866
KEYWORDS: Extreme ultraviolet, Semiconducting wafers, Photomasks, Fin field effect transistors, Optical lithography, Front end of line, Manufacturing, Back end of line, Yield improvement, Extreme ultraviolet lithography
Proceedings Article | 26 May 2022 Presentation + Paper
A yield prediction model and cost of ownership for productivity enhancement beyond imec 5nm technology node
Proceedings Volume 12052, 1205203 (2022) https://doi.org/10.1117/12.2617415
KEYWORDS: Extreme ultraviolet, Semiconducting wafers, Photomasks, Manufacturing, Optical lithography, Yield improvement, Front end of line, Semiconductor manufacturing, Performance modeling, Back end of line
Proceedings Article | 12 October 2021 Presentation + Paper
Analysis of advanced technology nodes and h-NA EUV introduction: a cost perspective
Gioele Mirabelli, Jane Wang, Darko Trivkovic, Pieter Weckx, Alessio Spessot, Kurt Ronse, Ryoung Han Kim, Geert Hellings, Julien Ryckaert
Proceedings Volume 11854, 118540D (2021) https://doi.org/10.1117/12.2600804
KEYWORDS: Extreme ultraviolet, Optical lithography, Metals, Lithography, Extreme ultraviolet lithography, Back end of line, Semiconducting wafers, Standards development, Front end of line, Very large scale integration
Proceedings Article | 23 March 2020 Presentation + Paper
Cost-performance optimization of fine-pitch W2W bonding: functional system partitioning with heterogeneous FEOL/BEOL configurations
Dragomir Milojevic, Eric Beyne, Geert Van der Plas, Jane Wang, Peter Debacker
Proceedings Volume 11328, 113280R (2020) https://doi.org/10.1117/12.2552036
KEYWORDS: Back end of line, Semiconducting wafers, Logic, System integration, 3D imaging standards, 3D modeling, Metals, Front end of line, Computing systems, Information operations
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