Mr. Michael Lang Profile

Michael Lang

at KLA GmbH

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Author

Publications (9)

Proceedings Article | 17 October 2008 Paper

Results of new mask contamination inspection capability STARlight2+ 72nm pixel with cell-to-cell HiRes5 for qualifying memory masks in wafer fabs

Raj Badoni, Jinggang Zhu, Russell Dover, Norbert Schmidt, Michael Lang, Andreas Jahnke, Florian Uhlig

Proceedings Volume 7122, 71223M (2008) https://doi.org/10.1117/12.802332

KEYWORDS: Inspection, Photomasks, Contamination, Semiconducting wafers, Sensors, Reticles, Crystals, Air contamination, SRAF, Wafer inspection

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Proceedings Article | 19 May 2008 Paper

Results of new mask contamination inspection capability STARlight2+ 72nm pixel for qualifying memory masks in wafer fabs

Russell Dover, Jinggang Zhu, Norbert Schmidt, Michael Lang

Proceedings Volume 7028, 70282N (2008) https://doi.org/10.1117/12.793093

KEYWORDS: Inspection, Photomasks, Contamination, Semiconducting wafers, SRAF, Signal detection, Detection and tracking algorithms, Defect inspection, Wafer inspection, Defect detection

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Proceedings Article | 2 May 2008 Paper

Introduction of new database reflected tritone algorithm for application in mask production

Thomas Schulmeyer, Heiko Schmalfuss, Jan Heumann, Michael Lang

Proceedings Volume 6792, 67920G (2008) https://doi.org/10.1117/12.798595

KEYWORDS: Inspection, Photomasks, Contamination, Databases, Defect inspection, Manufacturing, Lithography, Stereolithography, Astatine, Reticles

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At Photomask Japan 2007 the new algorithm of Fast Integrated die-to-die T+R (DDTR) for the views of P90 and P72 for the KLA Tencor TeraScanHR mask inspection system was presented. At the same time a new algorithm for P72 in database tritone mode for reflected light (DBRt) was introduced. Both modes can be used together as one combined inspection to detect pattern and contamination defects on production masks. It was shown that these new algorithms allow for creation of a new inspection strategy with improved throughput and a reduced amount of inspections. Currently an inspection strategy has to cover at first a pattern inspection (normally a combination of die-to-die and additional database inspections) for finding hard defects on a mask and then as second step a contamination inspection (STARlight2^TM). The hard defects have to be repaired and the contaminations can be cleaned. The new inspection strategy allows for detection of all critical hard and contamination defects on a mask with one single combined inspection, enhancing productivity. At BACUS 2007 the first evaluation of this new kind of inspection strategy for manufacturing of masks was described for two production plates of different design. At that time only the database reflected tritone algorithm for the view of P72 was available. The changes in inspection strategy could only go together with a change of view from P90 to P72. With view P72 higher overall sensitivity could be reached and smaller secondary features could be inspected. However, these improvements may not be necessary for all plates and may need more time than a comparable P90 inspection. Today the standard contamination inspection for critical masks is the P90 STARlight2^TM (SL2). To do a time effective parallel combo inspection with DDTR and DBRt the same view has to be used. An extension of the database reflected tritone algorithm to the P90 view is now available. This gives the mask manufacturer the flexibility to change the inspection strategy for P90 and P72 dependent only on feature size on mask or minimal allowed defect size. The results of the evaluation and the comparison of this P90 database reflected tritone algorithm with the P90 STARlight2^TM and P90 Fast Integrated die-to-die T+R will be presented in this paper. It will be shown that comparable results can be expected for P90 DBRt and P90 DDTR versus P90 STARlight2^TM without missing any critical defects.

Proceedings Article | 16 November 2007 Paper

Sensitivity comparison of fast integrated die-to-die T+R pattern inspection, standard database inspection, and STARlight2 contamination mode for application in mask production

Heiko Schmalfuss, Thomas Schulmeyer, Jan Heumann, Michael Lang, Jean-Paul Sier

Proceedings Volume 6730, 673025 (2007) https://doi.org/10.1117/12.747164

KEYWORDS: Inspection, Contamination, Photomasks, Defect detection, Databases, Defect inspection, Stereolithography, Modulation, Environmental sensing, Quartz

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Proceedings Article | 15 May 2007 Paper

Enhancing productivity and sensitivity in mask production via a fast integrated T+R pattern inspection and STARlight-2 contamination inspection on critical layers

Jean-Paul Sier, Eric Haodong Lu, Kaustuve Bhattacharyya, Swapnajit Chakravarty, Michael Lang, Heiko Schmalfuss, Jan Heumann, Thomas Schulmeyer

Proceedings Volume 6607, 66072C (2007) https://doi.org/10.1117/12.728995

KEYWORDS: Inspection, Defect detection, Contamination, Reticles, Photomasks, Defect inspection, Detection and tracking algorithms, Stars, Dysprosium, Optical properties

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Proceedings Article | 20 October 2006 Paper

High-resolution mask inspection in advanced fab

Stephanie Maelzer, Andre Poock, Bryan Reese, Kaustuve Bhattacharyya, Farzin Mirzaagha, Stephen Cox, Michael Lang

Proceedings Volume 6349, 63490S (2006) https://doi.org/10.1117/12.686402

KEYWORDS: Inspection, Reticles, Semiconducting wafers, Photomasks, Wafer inspection, Metals, Defect inspection, Lithography, Image transmission, Visualization

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Proceedings Article | 20 October 2006 Paper

Wafer fab mask qualification techniques and limitations

Andre Poock, Stephanie Maelzer, Chris Spence, Cyrus Tabery, Michael Lang, Guido Schnasse, Milko Peikert, Kaustuve Bhattacharyya

Proceedings Volume 6349, 63490U (2006) https://doi.org/10.1117/12.692525

KEYWORDS: Photomasks, Inspection, Semiconducting wafers, Wafer inspection, Reticles, Defect inspection, Defect detection, Wafer testing, Printing, Image resolution

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Proceedings Article | 24 May 2004 Paper

Defect inspection of Quartz-PSMs: taking a leap forward

Jan Heumann, Frank Schurack, Wolfgang Dettmann, Larry Zurbrick, Michael Lang

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.534057

KEYWORDS: Quartz, Inspection, Photomasks, Defect detection, Defect inspection, Phase shifts, Algorithm development, Semiconducting wafers, Detection and tracking algorithms, Lithography

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Proceedings Article | 27 December 2002 Paper

AltPSM inspection capability and printability of quartz defects

Jan Heumann, Mardjan Zarrabian, Mario Hennig, Wolfgang Dettmann, Larry Zurbrick, Michael Lang

Proceedings Volume 4889, (2002) https://doi.org/10.1117/12.467498

KEYWORDS: Quartz, Photomasks, Inspection, Defect detection, Scanning electron microscopy, Defect inspection, Semiconducting wafers, Resolution enhancement technologies, Algorithm development, Phase shifts

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Showing 5 of 9 publications

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