Fused quartz material demonstrates strong ultraviolet light transmission and resistance to laser damage, making it the primary choice for selecting large-diameter optical components in high-power laser systems. The challenge now lies in achieving low damages and high resistance to laser damage. A significant number of large-scale (with characteristic depths ranging from 10μm to 100μm) Sub Surface Damages (SSD) are generated in grinding stage, requiring substantial material removal during the subsequent polishing stage to ensure the damage resistance performance of the components. Therefore, it is crucial to study damage control in grinding stage for achieving optimal subsurface quality in optical components. This paper focuses on the processing state of fused quartz components under various grinding processes. Initially, a comparative experiment is conducted using loose abrasive and bonded abrasive with the same grain size (6μm), followed by an examination of three different grain sizes (6μm, 9μm, 20μm) of bonded abrasive grinding processes. After grinding, all processed samples are appropriately etched to reveal subsurface damages. The damage distribution and morphological information of the experimental samples are observed using optical microscopy and scanning electron microscopy. The value of surface roughness (Rz) of the fused quartz samples is measured using white light interferometry, and the corresponding SSD is calculated using the empirical formula of Kun Xiao. The findings indicate that the bonded abrasive processed samples exhibit higher removal efficiency and smaller SSD compared to the loose abrasive samples.
With the increasing energy of high power laser devices, the laser-induced damage of optical components, especially fused quartz components, has become one of the core problems in the development of high power laser devices. Studies show that pure fused quartz glass has a high intrinsic damage threshold, but fused quartz glass will inevitably introduce a large number of subsurface damage during the process of grinding and polishing, and these subsurface damage is one of the important factors leading to the decline of laser damage resistance of optical components. It is of great significance to study the subsurface damage of solid abrasive for improving the damage resistance threshold of optical components. In this experiment, 3M's abrasive pad is used as a solid abrasive. The subsurface damage of fine grinding elements are directly observed and analyzed by combining HF pickling and optical microscopy. The results show that various subsurface damage can be detected by optical microscopy after HF pickling. Profilometer is used to measure the surface roughness of the sample, the comparative analysis of the subsurface damage of the fine grinding elements shows that the elements with solid abrasive lapping have smaller roughness when the abrasive size is the same, which has a shallower depth of subsurface damage layer correspondingly.
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