Michael W. Lin,1 Daniel J. Hellebusch,1 Kai Wu,1 Eui Kyoon Kim,1 Kuan Lu,1 Li Tao,2 Kenneth M. Liechti,1 John G. Ekerdt,1 Paul S. Ho,1 Walter Hu,2 C. Grant Willson1
1The Univ. of Texas at Austin (United States) 2The Univ. of Texas at Dallas (United States)
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The step and flash imprint lithography (SFIL) process requires the clean separation of a quartz template from a polymer
imprint, and the force required to create this separation must be minimized to prevent the generation of defects.
According to fracture mechanics principles, decreasing both the imprint polymer modulus and the interfacial fracture
energy are beneficial for reducing the separation force. Adjusting the crosslinker concentration in the imprint
formulation decreases the modulus but does not significantly impact the facture energy. On the other hand, fluorinated
surfactant additives to the imprint fluid lower the modulus of the imprint polymer and decrease the fracture energy. The
fracture energy is further decreased by using a nonreactive, liquid surfactant versus a surfactant that reacts with the
polymer matrix. Angle-resolved X-ray photoelectron spectroscopy (XPS) results indicate that surfactant migration is
more effective with a fluorinated surface treatment compared to an untreated quartz surface. This result shows that the
use of fluorinated surfactants must be accompanied by a surface treatment that produces a similar energy or polarity to
induce migration and lower the adhesive strength.
Michael W. Lin,Daniel J. Hellebusch,Kai Wu,Eui Kyoon Kim,Kuan Lu,Li Tao,Kenneth M. Liechti,John G. Ekerdt,Paul S. Ho,Walter Hu, andC. Grant Willson
"Interfacial adhesion studies for step and flash imprint lithography", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69210E (20 March 2008); https://doi.org/10.1117/12.772797
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Michael W. Lin, Daniel J. Hellebusch, Kai Wu, Eui Kyoon Kim, Kuan Lu, Li Tao, Kenneth M. Liechti, John G. Ekerdt, Paul S. Ho, Walter Hu, C. Grant Willson, "Interfacial adhesion studies for step and flash imprint lithography," Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69210E (20 March 2008); https://doi.org/10.1117/12.772797