In this paper, we analyze the threshold voltage stability of beta-Ga2O3 FinFETs for power applications using Al2O3 as gate insulator. In dynamic characterization measurements, when the filling bias condition is moved from off-state to on-state a positive threshold voltage shift is induced, caused by the trapping of electrons in the insulator or at the insulator interface with the semiconductor. The threshold voltage variation was found to be stable in rest condition, but illumination by 280 nm UV light was able to slowly recover the threshold voltage even below its value before the filling condition was applied, suggesting the presence of natively trapped charge into the oxide even in the as-grown device. In order to obtain more information on the role of the external illumination, monochromatic excitation in the range from 1.5 eV to 5 eV was applied to the device before a transfer characteristic measurement. Results show that photon energies lower than 2.2 eV cause a positive threshold voltage shift, caused by charge trapping during the measurement phase and not related to illumination. Photon energies between 2.2 eV and 3.5 eV promote electron detrapping, leading to a partial recovery in the threshold voltage. Finally, energies above 3.5 eV cause an additional charge trapping process. The physical origin of the photon energy difference was investigated by monochromatic light-induced current transients, and a suitable model considering the conduction band discontinuities between the gate metal and the oxide and between the oxide and the semiconductor was developed to explain the experimental data.
This paper reviews the most relevant mechanisms responsible for the degradation of GaN-based lateral and vertical electron devices. These components are almost ideal for application in power electronics, but the presence of semiconductor defects and the existence of degradation processes may limit their stability and lifetime. In this paper we focus on the following aspects: (i) the degradation processes induced by off-state conditions and leading to a time-dependent and/or catastrophic breakdown of the devices; (ii) the stability of the gate stack; (iii) the degradation of the electrical performance of vertical GaN transistors and diodes. To discuss these topics, we refer to case studies carried out in our laboratories.
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